Expansion of the Cutting-edge ArF Photoresist Business for use in Semiconductor Manufacturing! Introduction of 45nm/32nm node Compatible “ArF Immersion Exposure Tool” aimed at Enhancing the Development of Next-Generation Immersion Photoresist FUJIFILM Corporation (President and CEO: Shigetaka Komori, hereafter “FUJIFILM”) outdid the competition in 2006 with its development of the “FAiRS-9000 Series,” a 45nm node*1 compatible [...]
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